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The need to confirm compliance with the requirements of the Polish Defence Standards, STANAGs and shipping classification societies documents poses new challenges for manufacturers and suppliers of ship’s equipment and systems. T...
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The need to confirm compliance with the requirements of the Polish Defence Standards, STANAGs and shipping classification societies documents poses new challenges for manufacturers and suppliers of ship’s equipment and systems. This is related to the continuous technical evolution of electronic and electrotechnical devices, especially in the field of wireless transmission and data exchange. These challenges also apply to research laboratories, which must keep up with both the technological changes of the examined objects and the updating of requirements and reference documents. It is connected with the necessity of constant development in the area of technical facilities and competences. This paper presents an overview of the currently binding requirements for devices and systems for newly built vessels, with particular regard on the area of electromagnetic compatibility. It indicates the planned trends of changes of these requirements in relation to the technical evolution of devices. Discussion with several examples of problems and challenges faced by both equipment suppliers and research laboratories engineers were presented.
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In the electromagnetic compatibility (EMC) behavior of power electronic converters, it is important to predict the near-field coupling between the complex components (e.g., in EMC filter). Using the components of the near-field mu...
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In the electromagnetic compatibility (EMC) behavior of power electronic converters, it is important to predict the near-field coupling between the complex components (e.g., in EMC filter). Using the components of the near-field multipolar expansion of electromagnetic sources, the close magnetic coupling between two elements is determined from their equivalent model. In this paper, a new measurement system, based on spherical harmonics and spatial filtering, is proposed and studied. The sensor is a single coil moving along one axis, and coupled with a rotatable mount for the measured source with two axes of rotation and . This simple system, which can be easily automated, allows building good accuracy models for complex sources. The impact of the uncertainties in the position and orientation of the source and sensor is studied in order to determine the higher degree of the multipolar expansion that can be characterized. Taken into account these uncertainties and the expected precision of the reconstructed source, strategies of measurement minimizing the number of measurements are compared.
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In this article, we show the change of electromagnetic emission (EME) of integrated circuits (ICs) and their external circuitry induced by the presence of ionizing radiation. We use the 150 Ohm method according to IEC 61967-4 to c...
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In this article, we show the change of electromagnetic emission (EME) of integrated circuits (ICs) and their external circuitry induced by the presence of ionizing radiation. We use the 150 Ohm method according to IEC 61967-4 to characterize the conducted emission of our tested integrated circuit (IC) at the VDD pin. Simultaneously to measuring the electromagnetic emission, we irradiate the IC with X-rays. The irradiation process is carried out up to a dose of 5Mrad using a high-power X-ray radiation source. The electromagnetic emission spectra are retrieved before, during and after the irradiation process. We also show that special caution regarding radio frequency (RF) measurements must be used when performing combined testing. Therefore, we analyze the composition of measurement uncertainties of electromagnetic compatibility in combination with ionizing radiation hardness characterization. This article contains measurement results showing the negative impact of ionizing radiation on the electromagnetic compatibility (EMC) of an IC. Additionally we provide measures to ensure properly combined measurements of EME and ionizing radiation. Therefore we show how to reduce the electromagnetic interference originating from the high-voltage generator that is necessary to generate X-rays.
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Reliable operation of the smart grid requires assurance of the electromagnetic compatibility of sensitive smart metering systems and power electronic converters, which introduce high-level electromagnetic interference. As it has b...
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Reliable operation of the smart grid requires assurance of the electromagnetic compatibility of sensitive smart metering systems and power electronic converters, which introduce high-level electromagnetic interference. As it has been experimentally shown, currently available, normalized, and frequency domain tests are ineffective for the evaluation of data transmission error hazards. The mathematical time-domain model proposed in this paper enables assessment of the probability of errors occurring in a given transmission signal for known interference parameters. The validity of the model and its practical applicability have been experimentally verified.
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Today's state of the art power electronics system require the design engineers to employ an integrated approach, utilizing IGBTs, heat sink, capacitors and gate driver circuits at their peak performance. While functionality is of ...
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Today's state of the art power electronics system require the design engineers to employ an integrated approach, utilizing IGBTs, heat sink, capacitors and gate driver circuits at their peak performance. While functionality is of course always important, the problem of manufacturability, cost and electromagnetic compatibility (EMC) are elements that have to be kept into account. In this paper the authors show how electromagnetic interference caused by power electronic circuits can be reduced by the minimization of the total inductance commutation loop of an inverter leg. At the same time special attention is due to the compactness of the inverter especially as regard to the heat sink and the thermal issues. The goal is a proper design and construction of the inverter so tackling EMI directly at the source where most EMI is generated. In this way application of expensive EMI filters can be avoided. Moreover the analysis of the thermal behavior is shown. In order to reach this goal a proper selection and design of the inverter parts have been made and implemented. Specifically, a prototype of converter has been developed to reach the maximum reduction of the stray inductance commutation loop and the maximum compactness using the actual available technology. Experimental results are given to show the validity of this approach.
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EMC compliance is a mandatory requirement for electronic and electrical devices export to European countries and the USA. Hong Kong is an export-oriented city with 23% of the total export in electronic and electrical products; kno...
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EMC compliance is a mandatory requirement for electronic and electrical devices export to European countries and the USA. Hong Kong is an export-oriented city with 23% of the total export in electronic and electrical products; knowledge in EMC design and standards are highly desirable to engineers in Hong Kong. To cater for these particular needs of the local industry, EMC was introduced as an undergraduate course in 1994, prior to the effective date of implementation of EMC Directive 89/336/EEC in 1996. After 15-years of development and modification, the EMC course has now become one of the most popular postgraduate courses in Hong Kong. The course includes lectures, EMC standard interpretation, case studies, together with an emphasis on the hands-on experience of EMC tests and facilities in the EMC test laboratory. In this paper, a summary of the development of the EMC course at the City University of Hong Kong in the last decade are presented, and some possible future EMC needs are discussed at the end.
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Magnetic components are widely used in power electronics and are the main cause of electromagnetic couplings. Among them, coils with ferromagnetic cores belong to the class of components that are used the most. However the behavio...
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Magnetic components are widely used in power electronics and are the main cause of electromagnetic couplings. Among them, coils with ferromagnetic cores belong to the class of components that are used the most. However the behavior in terms of radiation and coupling to the environment of these components is not widely explored. This paper defines a more accurate model for coils with toroidal ferrite cores in order to get a better understanding of the coupling they created. Then the effects of the winding layout around a toroidal core are first discussed. It is found that the winding topology is the major parameter controlling both the radiated field pattern and its magnitude. A measurement bench has then been developed to validate the hypothesis made. Finally, numerical and analytic models have been elaborated to predict radiated fields from magnetic components.
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This paper presents a methodology to evaluate different integrated-circuit substrate technology options in terms of interference coupling. It is based on the electromagnetic characterization of the different substrate configuratio...
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This paper presents a methodology to evaluate different integrated-circuit substrate technology options in terms of interference coupling. It is based on the electromagnetic characterization of the different substrate configurations as radial multilayered dielectric lossy open waveguides and the selection of the propagation modes that effectively contribute to substrate coupling. In addition, attenuation patterns are obtained for different technologies, doping profiles, frequencies, and interference mechanisms in order to provide a tool for early interference prediction, electromagnetic compatibility performance evaluation and floorplan strategy definition.
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In this paper, a test setup is proposed for quantification of electromagnetic interference (EMI) in an enclosure of digital systems. Small probes at the casing walls are used to measure the internal fields and derive network param...
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In this paper, a test setup is proposed for quantification of electromagnetic interference (EMI) in an enclosure of digital systems. Small probes at the casing walls are used to measure the internal fields and derive network parameters for the typical coupling between internal components. It is shown that the setup is viable for estimating EMI between enclosed components in a frequency range from to . Measurement results from the proposed setup are in excellent agreement with those of analytical and numerical methods. A statistical approach is introduced to evaluate the measurement results from a twelve-port vector network analyzer at high frequencies above the first resonance. Using this approach, typical components in digital systems are analyzed and simplified geometrical models are given. These models allow full-wave simulations of realistic setups with feasible computation times. A good model-to-hardware correlation between simulation and measurement results over the whole frequency range is achieved. It is demonstrated that the proposed measurement and evaluation approach of the fabricated cavity shows the same characteristic behavior of a real office workstation with internal components.
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Based on the survey of the papers and their topics presented at the latest international symposia on electromagnetic compatibility (EMC), a technical trend on EMC technology was described. The major trends include printed circuit ...
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Based on the survey of the papers and their topics presented at the latest international symposia on electromagnetic compatibility (EMC), a technical trend on EMC technology was described. The major trends include printed circuit board and integrated circuit related EMC problems, numerical modeling, statistical measurement and design, and human exposure, which should be selected as significant topics at the coming EMC international symposia.
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